简述芯片制造的全过程

文章来自微信公众号“科文路”，欢迎关注、互动。转发须注明出处。

IC 行业现在这么火，你知道一颗芯片是经过怎样的流程被制造出来的吗？

内容简单，我们不妨用英文来学习。

摘自《Computer Organization and Design》 5th

After being sliced（切片） from the silicon ingot（硅锭）, blank wafers（晶圆） are put through 20 to 40 steps to create patterned（曝光成像） wafers.

These patterned wafers are then tested with a wafer tester, and a map of the good parts is made. Next, the wafers are diced into dies（晶片）. In this figure, one wafer produced 20 dies, of which 17 passed testing. (X means the die is bad.) The yield of good dies in this case was 17/20, or 85%.

These good dies are then bonded into packages（封装） and tested one more time before shipping the packaged parts to customers. One bad packaged part was found in this final test.

• silicon ingot,

都看到这儿了，不如关注每日推送的“科文路”、互动起来~